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 TPC8013-H
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (High speed U-MOS III)
TPC8013-H
High Speed and High Efficiency DC-DC Converters Notebook PC Applications Portable Equipment Applications
* * * * * * * Small footprint due to small and thin package High speed switching Small gate charge: Qg = 48 nc (typ.) Low drain-source ON resistance: RDS (ON) = 5.4 m (typ.) High forward transfer admittance: |Yfs| = 25 S (typ.) Low leakage current: IDSS = 10 A (max) (VDS = 30 V) Enhancement-mode: Vth = 1.1 to 2.3 V (VDS = 10 V, ID = 1 mA) Unit: mm
Maximum Ratings (Ta = 25C)
Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 kW) Gate-source voltage Drain current DC Pulse (Note 1) (Note 1) (t = 10 s) (Note 2a) Drain power dissipation (t = 10 s) (Note 2b) Single pulse avalanche energy (Note 3) Avalanche current Repetitive avalanche energy (Note 2a) (Note 4) Channel temperature Storage temperature range Symbol VDSS VDGR VGSS ID IDP PD PD EAS IAR EAR Tch Tstg Rating 30 30 20 15 60 1.9 Unit V V V A
JEDEC JEITA TOSHIBA
2-6J1B
Drain power dissipation
W
Weight: 0.080 g (typ.)
1.0
W
146 15 0.19 150 -55 to 150
mJ A mJ C C
Circuit Configuration
8 7 6 5
Note: For (Note 1), (Note 2), (Note 3) and (Note 4), please refer to the next page. This transistor is an electrostatic sensitive device. Please handle with caution.
1
2
3
4
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2002-03-25
TPC8013-H
Thermal Characteristics
Characteristics Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Symbol Rth (ch-a) Max 65.8 Unit C/W
Thermal resistance, channel to ambient (t = 10 s) (Note 2b)
Rth (ch-a)
125
C/W
Marking (Note 5)
TPC8013 H
TYPE
Note 1: Please use devices on condition that the channel temperature is below 150C. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b)
FR-4 25.4 25.4 0.8 (unit: mm)
FR-4 25.4 25.4 0.8 (unit: mm)
(a)
(b)
Note 3: VDD = 24 V, Tch = 25C (initial), L = 0.5 mH, RG = 25 W, IAR = 15 A Note 4: Repetitive rating: pulse width limited by max channel temperature Note 5: * on lower left of the marking indicates Pin 1. shows lot number. (year of manufacture: last decimal digit of the year of manufacture, month of manufacture: January to December are denoted by letters A to L respectively.)
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TPC8013-H
Electrical Characteristics (Ta = 25C)
Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time Fall time Turn-OFF time Total gate charge (gate-source plus gate-drain) Gate-source charge 1 Gate-drain ("miller") charge Gate switch charge tf toff Qg Qgs1 Qgd QSW VDD ~ 24 V, VGS = 10 V, ID = 15 A Symbol IGSS IDSS V (BR) DSS V (BR) DSX Vth RDS (ON) |Yfs| Ciss Crss Coss tr ton VGS 10 V 0V 4.7 W VDS = 10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 16 V, VDS = 0 V VDS = 30 V, VGS = 0 V ID = 10 mA, VGS = 0 V ID = 10 mA, VGS = -20 V VDS = 10 V, ID = 1 mA VGS = 4.5 V, ID = 7.5 A VGS = 10 V, ID = 7.5 A VDS = 10 V, ID = 7.5 A Min 3/4 3/4 30 15 1.1 3/4 3/4 12.5 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Typ. 3/4 3/4 3/4 3/4 3/4 6.6 5.4 25 2380 410 980 9.8 21 15 60 46 26 7.2 12.2 15.6 Max 10 10 3/4 3/4 2.3 9.5 6.5 3/4 3/4 3/4 3/4 3/4 3/4 ns 3/4 3/4 3/4 3/4 3/4 3/4 3/4 nC pF Unit mA mA V V mW S
ID = 7.5 A VOUT RL = 2 W
VDD ~ 15 V < 1%, tw = 10 ms Duty = VDD ~ 24 V, VGS = 10 V, ID = 15 A VDD ~ 24 V, VGS = 5 V, ID = 15 A -
Source-Drain Ratings and Characteristics (Ta = 25C)
Characteristics Drain reverse current Forward voltage (diode) Pulse (Note 1) Symbol IDRP VDSF Test Condition 3/4 IDR = 15 A, VGS = 0 V Min 3/4 3/4 Typ. 3/4 3/4 Max 60 -1.2 Unit A V
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2002-03-25
TPC8013-H
ID - VDS
10 10 4.5 2.9 2.8 8 2.75 2.7 6 2.65 4 2.6
Common source Ta = 25C, pulse test
ID - VDS
20 10 4.5 3.1 3
Common source Ta = 25C, pulse test
16
2.9
(A)
ID
ID
(A)
12
2.8
Drain current
Drain current
8 2.7 2.6 4 2.4 V VGS = 2.4 V 0.4 0.8 1.2 1.6 2.0
2
2.5 VGS = 2.4 V
0 0
0.2
0.4
0.6
0.8
1.0
0 0
Drain-source voltage
VDS
(V)
Drain-source voltage
VDS
(V)
ID - VGS
50 Common source VDS = 10 V Pulse test 1
VDS - VGS
Common source Ta = 25C Pulse test
(V) VDS Drain-source voltage
40
0.8
ID
(A)
30
0.6
Drain current
20 25 10 100 Ta = -55C 0 0 1 2 3 4 5 6
0.4 ID = 15 A 0.2 3.8 0 0 7.5
2
4
6
8
10
12
Gate-source voltage
VGS
(V)
Gate-source voltage
VGS
(V)
|Yfs| - ID
(S)
100 100
RDS (ON) - ID
Common source Ta = 25C Pulse test
iYfsi
Ta = -55C 10 100 25
Forward transfer admittance
Drain-source ON resistance RDS (ON) (mW)
10
VGS = 4.5 V
1
10
Common source VDS = 10 V Pulse test 0.1 0.1 1 10 30 1 0.1 1 10 100
Drain current
ID
(A)
Drain current
ID
(A)
4
2002-03-25
TPC8013-H
RDS (ON) - Ta
12 100 5
IDR - VDS
Drain-source ON resistance RDS (ON) (mW)
ID = 15, 7.5, 3.8
Drain reverse current IDR
(A)
10
10
8 VGS = 4.5 V 6 ID = 15, 7.5, 3.8 10
10
3 VGS = 0 V 1
4
1
2 Common source Pulse test 0 -80 -40 0 40 80 120 160
0.1 0
Common source Ta = 25C Pulse test -0.2 -0.4 -0.6 -0.8 -1
Ambient temperature Ta (C)
Drain-source voltage
VDS
(V)
Capacitance - VDS
10000 2.5
Vth - Ta
Gate threshold voltage Vth (V)
Ciss
2
(pF)
1000 Coss Crss 100 Common source VGS = 0 V f = 1 MHz Ta = 25C 1 10 100
1.5
Capacitance C
1
0.5
Common source VDS = 10 V ID = 1 mA Pulse test -40 0 40 80 120 160
10 0.1
0 -80
Drain-source voltage
VDS
(V)
Ambient temperature Ta (C)
PD - Ta
2 (1)
(1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b)
Dynamic input/output characteristics
40 Common source Ta = 25C ID = 15 A Pulse test VDD = 24 V 12 VDS 12 10 6 2 VGS 6 4 6 VDD = 24 V 8 16 14 12 10
(W)
(V)
1.6
PD
VDS
Drain power dissipation
Drain-source voltage
(2) 0.8
20
0.4
0 0
50
100
150
200
0 0
10
20
30
40
50
0 60
Ambient temperature Ta (C)
Total gate charge Qg (nC)
5
2002-03-25
Gate-source voltage
1.2
t = 10 s
VGS
30
(V)
TPC8013-H
rth - tw
1000
(1) Device mounted on a glass-epoxy board (a) (Note 2a) Device mounted on a glass-epoxy board (b) (Note 2b)
Normalized transient thermal impedance rth (C/W)
(2)
(2)
100
t = 10 s (1)
10
1
Single pulse
0.1 0.001
0.01
0.1
1
10
100
1000
Pulse width
tw
(S)
Safe operating area
100 ID max (pluse) * 1 ms* 10
Drain current
ID
(A)
10 ms*
1
0.1
0.01 0.01
* Single pulse Ta = 25C Curves must be derated linearly with increase in temperature. 0.1 1
VDSS max 10 100
Drain-source voltage
VDS
(V)
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2002-03-25
TPC8013-H
RESTRICTIONS ON PRODUCT USE
000707EAA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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2002-03-25


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